Our mission is to go beyond the ordinary customer-supplier relationship. We treat every foundry customer as our strong partner and we measure our success one at a time, based on each and every customer’s total satisfaction and success. Win-win together is our goal; Manufacturing high quality IC wafers for our partners at a competitive price is our commitment.

-- MISSION --

Our vision is to become a global leading Analog/Mixed-Signal and Smart Power foundry provider/partner for Quality, IP-oriented Design Houses, Fabless, and Fab-light IDM companies.

-- VISION --

TELEFUNKEN processes allow us to offer World Class Analog & Mixed Signal Foundry Services for RF, Power Management, and High Voltage High Temperature Automotive Applications.

-- TECHNOLOGY --

Our mission is to go beyond the ordinary customer-supplier relationship. We treat every foundry customer as our strong partner and we measure our success one at a time, based on each and every customer’s total satisfaction and success. Win-win together is our goal; Manufacturing high quality IC wafers for our partners at a competitive price is our commitment.

-- MISSION --

Our vision is to become a global leading Analog/Mixed-Signal and Smart Power foundry provider/partner for Quality, IP-oriented Design Houses, Fabless, and Fab-light IDM companies.

-- VISION --

TELEFUNKEN processes allow us to offer World Class Analog & Mixed Signal Foundry Services for RF, Power Management, and High Voltage High Temperature Automotive Applications.

-- TECHNOLOGY --

Our mission is to go beyond the ordinary customer-supplier relationship. We treat every foundry customer as our strong partner and we measure our success one at a time, based on each and every customer’s total satisfaction and success. Win-win together is our goal; Manufacturing high quality IC wafers for our partners at a competitive price is our commitment.

-- MISSION --

Our vision is to become a global leading Analog/Mixed-Signal and Smart Power foundry provider/partner for Quality, IP-oriented Design Houses, Fabless, and Fab-light IDM companies.

-- VISION --

TELEFUNKEN processes allow us to offer World Class Analog & Mixed Signal Foundry Services for RF, Power Management, and High Voltage High Temperature Automotive Applications.

-- TECHNOLOGY --

Our mission is to go beyond the ordinary customer-supplier relationship. We treat every foundry customer as our strong partner and we measure our success one at a time, based on each and every customer’s total satisfaction and success. Win-win together is our goal; Manufacturing high quality IC wafers for our partners at a competitive price is our commitment.

-- MISSION --

Our vision is to become a global leading Analog/Mixed-Signal and Smart Power foundry provider/partner for Quality, IP-oriented Design Houses, Fabless, and Fab-light IDM companies.

-- VISION --

TELEFUNKEN processes allow us to offer World Class Analog & Mixed Signal Foundry Services for RF, Power Management, and High Voltage High Temperature Automotive Applications.

-- TECHNOLOGY --

TELEFUNKEN has always been synonymous with leading edge technologies.

 

TELEFUNKEN Semiconductors offers extremely flexible world class analog & mixed-signal foundry services from small MPW projects up to very large lot sizes in highest industrial quality.

 

With its 8-inch fabrication plant in Roseville, California and 6-inch fabrication facility in Heilbronn, Germany, the company can manufacture in a large array of versatile processes which address analog, mixed-signal and specialty technologies from deep-submicron to high-voltage BCDMOS processes especially designed for power management applications.

Press

 

SMART-POWER TECHNOLOGIES

Combining sophisticated control logic with the management of high voltages and currents, smart-power technologies are at the leading edge of semiconductor design worldwide.
Read More About This Feature...

 

TFBCD080-HV

TFBCD080-HV Process

The TFBCD080-HV process is a 0.8 µm Very High Voltage BCDMOS Technology. The process combines a very high voltage capability with high integration density, low RDSon and as well digital as analog capabilities.
Read More About TFBCD080-HV...

 

TFSmart2

TFSmart 2

TFSMART 2 is the second generation technology of TFSMART 2 using HV BCD on SOI with the smaller feature size of 0.35 µm.The advantages of the TFSMART 2 SOI-technology compared to conventional bulk technologies with double-diffused bodies are the future of new technology opportunities.
Read More About TFSmart2...

 

Heilbronn/Germany

Roseville/USA